Customization: | Available |
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Feature: | Heat Insulation |
Material: | Phenolic Resin |
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Item | Unit | Specification |
Panel Structure | Aluminum foil/Phenolic or PIR/Aluminum foil | |
Standard Panel Size | mm | 3950*1200*20 |
Fireproof | grade | BS476 CLASS O |
Alu. Foil Thickness | micron | 40/60/80 |
Foam Density | kg/m3 | 40/50/60 |
Thermal Conductivity | w/m.k | 0.02-0.025 |
Compressing Strength | Mpa | 0.2 |
Bending Strength | Mpa | 2 |
Water Absorption | % | ≤0.1 |
Dimension Change | % | 0.3 |
Working Temperature | ºC | -150 to +120 |
Maximum Allowable Wind Velocity | m/s | ≤12 |
Continuous Running Maximum Temperature | ºC | ≤70 |
Thermal insulations: The thermal conductivity of phenolic foam is very low (0.021-0.028W/mk).
Fireproof: High Oxygen percent requirement. No dropping, no melting under high temperature but carbonized.
Less smoke emission and harmfulness: Low smoke emission under high temperature.
Chemical Resistances: Extreme anti-corrosion for acidity and alkalescency.
Durability: Available working temperature scale -140ºC to 160ºC. stable physical feature
Impervius: good closed cell structure, water absorption is low, performance of prevent the penetration of vapor is strong
Sound Absorption and noise reduction: has excellent sound absorption and noise reduction performance
Samll density, light weight: Phenlic insulation board density is below 100kg/m3, even as low as 50kg/m3
ASTM E-84, BS476, and UL181